苏州盛格纳电子有限公司

INLINE WAFER FLUX WASH /SCRUBBER: ULTRA 2C

Ultra 2C Flux Wash and single wafer scrubber machines normally serve as backend process during WLCSP, Ball Drop, Copper Pillar processes after inline reflow process. Our inline Flux Wash and single wafer scrubber has two loadports and two cleaning chambers and can be operated fully automatically.

Product Features and Benefits

•  Extension buffer unloader stage for 12-inch wafer.

•  Buffer function with reflow interlock.

•  Automatic centering alignment.

•  CCTV monitor.

•  Vacuum detection system.

•  Flat panel display and keyboard.

•  Highest temperature up to 80 degree.

•  Two fluid cleaning mechanism.

•  2 sets high pressure devices for cleaning chambers: optional.

•  Carbon Oxide mixing tool: Optional.

•  UPS System: Optional.

•  Equipped FFU upon Cleaning chambers with automatic control system and display interface.

•  300 mm Double handling robot with Vacuum.

The cleaning unit is equipped with a set of vacuum chucks for adsorbing wafers;

Liquid: DIW or CO2/DIW.

Arm1 is equipped with a high-pressure and high-temperature DIW nozzle, with a maximum high-pressure pressure of up to 15MPa- High pressure cleaning.

Arm2 is equipped with a two fluid cleaning nozzle, greatly improving the cleaning ability; Gas (N2): spray generation and acceleration; The boundary layer is thinner, which can remove fine particles better and reduce

damage Mist rapidly collapses and diffuses on the surface of the wafer, and the role of microfluidics is to remove surface particles.

DIW maximum water heating to 80 ° C.

The back spray system is equipped with ambient temperature DIW to protect the back of the wafer.

The material drying and nitrogen air drying mechanism cleaning chamber FFU requires protective nets at the exhaust ports of each chamber to prevent foreign objects from entering the factory exhaust.