苏州盛格纳电子有限公司

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苏州盛格纳电子有限公司
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网站首页 产品中心>Wafer Single-Unit Cleaning Specification Catalog
Flux wash
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  • Flux wash
Flux wash

Ultra 2C Flux Wash and single wafer scrubber machines normally serve as backend process during WLCSP, Ball Drop, Copper Pillar processes after inline reflow process. Our inline Flux Wash and single wafer scrubber has two loadports and two cleaning chambers and can be operated fully automatically.

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INLINE WAFER FLUX WASH /SCRUBBER: ULTRA 2C


Ultra 2C Flux Wash and single wafer scrubber machines normally serve as backend process during WLCSP,

Ball Drop, Copper Pillar processes after inline reflow process. Our inline Flux Wash and single wafer scrubber

has two loadports and two cleaning chambers and can be operated fully automatically.

 

Option : 2-6 clean chamber

 

Product Features and Benefits


•  Extension buffer unloader stage for 12-inch wafer.

•  Buffer function with reflow interlock.

•  Automatic centering alignment.

•  CCTV monitor.

•  Vacuum detection system.

•  Flat panel display and keyboard.

•  Highest temperature up to 80 degree.

•  Two fluid cleaning mechanism.

•  2 sets high pressure devices for cleaning chambers: optional.

•  Carbon Oxide mixing tool: Optional.

•  UPS System: Optional.

•  Equipped FFU upon Cleaning chambers with automatic control system and display interface.

•  300 mm Double handling robot with Vacuum.



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