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公司地址：苏州市工业园区青剑湖科技园2A
1. Compatible with Bumping: Wlcsp Ball Drop with Wafer Flux print Process 2. Compatible with WLCSP: Ideal for Ball drop process,
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INLINE WAFER Wlcsp
1. Compatible with Bumping: Wlcsp Ball Drop with Wafer Flux print Process.
2. Compatible with WLCSP: Ideal for Ball drop process.
Product Features and Benefits
• Pairs with all types of process tools and environments.
• Super reliable, absolute encoder, 3-axis robots.
• Can service up to 3 process tools.
• Interface Ports: SMEMA & SECS/GEM Interfaces.
• Aligner OCR: Optional.
• Full safety guarding S2 compliant.
• Standard Accessories: Ionization Bars.
• FOUP Opener: Mini Environment.
• FOUP Pod Opener: Compatible Transfer Station.
• 300 mm automation platform, adaptable for 200 mm and smaller substrates.
• Robots fitted with range of end effector technologies, including vacuum, Bernoulli, edge grip and more.
• Options reflow spec.
• Options inline scrubber Spec.
SPECIFICATIONS
Machine Footprint | Option Spec |
Robot Placement | ±100 µm |
Clean Room Classification | Standard can be cleanroom 100 |
Wafer Interface Options | - SMEMA - Transfer Station - Loadport Positions Available 1 or 2 -With other Machine interface, etc. Reflow Spec Scrubber Spec |
MTBF | 60,000 hours |
Uptime | >98% |
Full SEMI Compliance | SEMI S2, S8 Compliant |
Monitor | CCTV |
Handling Capabilities | - Thin Wafers - Bonded Wafers - Warped Wafers - Perforated Wafers - Thick Wafers - Trenched Wafers - to be continued |