苏州盛格纳电子有限公司

WAFER Flux  or solder Paster stencil Cleaning Equipment

The WF300 is a stencil cleaning machine that utilizes an aqueous cleaning solution for washing, DI water for rinsing, and hot air for drying. It is designed for automated cleaning of flux from BGA stencils, solder paste stencils, and red glue stencils/copper meshes. The machine features exclusive rinse modes with both closed-loop and open-loop options to accommodate different rinsing requirements.  This equipment adopts a unique structural design where the stencil moves back and forth while the spray bars and air knives remain fixed. It automatically completes the entire process—cleaning, rinsing, and drying—within a single unit. During cleaning, nozzles on both left and right spray bars operate simultaneously, ensuring equipment stability, balanced stencil tension, and superior cleaning quality.

Product Features and Benefits

•  Wide Application Range: Suitable for cleaning Wafer solder paste stencils.

•   Industry's Most Stable Stencil Cleaning Mechanism.

•  Symmetrical Vertical Spray Cleaning on Both Sides:

•  Real-time Circulation and Filtration of Aqueous Cleaning Solution.

•  Four Parallel Spray Bars on Left and Right Sides.

•  High-Volume Four-Air-Knife System on Both Sides.

•  One-Touch Operation.

•  Viewing Window on Cleaning Chamber:

•  Panel-Mounted Liquid Pressure Gauges.

•  Full SUS304 Stainless Steel Construction.

•  High-Quality Electric/Pneumatic Components:

SPECIFICATIONS