苏州盛格纳电子有限公司

WAFER Flux  or ball Drop stencil  inspection

WSI-300 Wafer Printing & Bumping Stencil Inspector is specifically designed for the precision inspection of stencils used in wafer flux printing and solder ball bumping processes

Currently, there is a severe lack of effective means for incoming quality control and in-process cleaning validation of wafer-level stencils. Traditional manual inspection is time-consuming and labor-intensive. Given the high cost of 8/12-inch bumping stencils, manual checks can only roughly identify physical damage, while failing to fully inspect critical parameters such as aperture accuracy, thickness, quantity, and quality. A 100% full inspection cannot be achieved, and it is impossible to accurately judge specifications between ＞40μm and ＜200μm under high process requirements. Microscopy only allows for partial visual checks, leading to high omission rates. Without data management, problems with expensive bumping and printing stencils cannot be detected in a timely and effective manner. The WSI-300 addresses these gaps by enabling: new stencil aperture accuracy and quality inspection, used stencil cleaning effect verification, foreign object detection, tension measurement, and stencil precision comparison.

Product Features and Benefits

4.11 Incoming Inspection for Flux Printing/Bumping Stencils: Perform comprehensive detection of new stencils before they enter production, ensuring the rationality and correctness of aperture designs.

4.12 In-Process Control & Monitoring of Flux Printing/Bumping Stencils: Track and record changes in stencil precision and tension over different usage periods, ensuring stencil service life and traceable data management. 4.13 Process Data Overlay & Analysis for Flux Printing/Bumping Stencils: Enable stencil process data overlay to optimize manufacturing processes.

 SPECIFICATIONS