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公司地址：苏州市工业园区青剑湖科技园2A
WSI-300 Wafer Printing & Bumping Stencil Inspector is specifically designed for the precision inspection of stencils used in wafer flux printing and solder ball bumping processes.
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EFEM & Sorter & Packer Sorter
The Ultra-WS812 is a highly configurable, BOLTS-compatible robotic wafer-handling cell that mates.
high performance with cost competitiveness. As an ISO Class-2 clean FEOL wafer Sorter, this platform.
includes all applicable mini-environment components, E84 compliance and rear hand-off. Product Features and Benefits.
• Pairs with all types of processtools and environments. • Super reliable, absolute encoder, 4-axisrobots. • Can service up to 3 processtools. • Interface Ports: SMEMA & SECS/GEM Interfaces.
• Aligner OCR: Optional • Fullsafety guarding S2 compliant. • Standard Accessories: Ionization Bars.
• FOUP Opener: Mini Environment • FOUP Pod Opener: Compatible Transfer Station.
• 300 mm automation platform, adaptable for 200 mm and smallersubstrates. • Robots fitted with range of end effector technologies, including vacuum, Bernoulli, edge grip and more.
SPECIFICATIONS
Machine Footprint | 1630 *1500 *2100 mm |
Robot Placement | ±100 µm |
Clean Room Classification | Standard can be cleanroom 100 |
Wafer Interface Options | - SMEMA - Transfer Station - Loadport Positions Available 1 or 2 /3/4 -With other Machine interface, etc |
MTBF | 60,000 hours |
Uptime | >98% |
Full SEMI Compliance | SEMI S2, S8 Compliant |
Monitor | CCTV |
Handling Capabilities | - Thin Wafers- Bonded Wafers - Warped Wafers- Perforated Wafers - Thick Wafers- Trenched Wafers - to be continued |
Ultra-WS812-CWB | |
Machine LP Qty | 2/3/4/5/6/8 Load Port |
Wafer size | Compatible with 200mm-300mm wafers |
Wafer thickness | 300~1000um, warpage ≤ 1mm |
Robot | SCR dual-arm robot/Ultra-thin vacuum Finger |
OCR (IOSS) | high-definition reading of Wafer ID (optional). |
Sorter Type | Foup /open cassette to Foup /open cassette |
Sorter Type | From Foup to sorting Cake wafer Box/Stack Box |
Double display | CCTV monitoring and operations |
AMR options | Equipped with E84 module,supporting crane material handling (optional). |
Unit Spec | RF ID reading. EFU & Ionizer |
SECSGEM | EAP integration to enable data upload |
Cake wafer Box/Stack Box（卡扣式） | sort: transfer/split/ merge |
The system performsin-cassette wafer distance detection, allowing safe pick-and-place operationsto be performed from the front face of the wafer. It is capable of identifying separator materials of multiple material types and colors, and detecting overlapping separatorsheetsto ensure proper placement. The system also supports wafersorting (transfer/split/merge) based on wafer position or ID, with a handling throughput of 120 wafers per hour.
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