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PEB Oven Model RHC200 Power Supply: 220 V, 50/60 Hz, 1-Phase 3-Wire Fully enclosed work cell with safety interlock doors
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PEB Oven Model RHC200
Power Supply: 220 V, 50/60 Hz, 1-Phase 3-Wire Fully enclosed work cell with safety interlock doors
Heating Zone: 1 zone equipped with guide ring; Max. temperature: 150 °C; Temperature control accuracy: ±2 °C
Cooling Zone: 1 zone equipped with guide ring; Set temperature: 23 °C; Temperature control accuracy: ±2 °C
Process temperature & dwell time regulated via PC controller 8-inch (200 mm) EFEM stage with wafer mapping function Mapping items: Wafer cross mark detection, double wafer detection, wafer cassette position verification.
Single-wafer handling robot
Wafer alignment accuracy: ±0.05°; Wafer placement accuracy: ±50 μm
High-temperature resistant vacuum end-effector with vacuum detection system
Built-in barcode scanning function
Fully automatic PC control system with logo display
3-color status indicator light tower with audible alarm
Operating System: Windows 10 or higher
Equipped with flat panel display & industrial keyboard
Integrated UPS power supply system
Fully compliant with SEMI standards
Equipped with static elimination ionization bars
2. Technical Specifications
Item | Specification |
Number of Heating Zones | 1 |
Number of Cooling Zones | 1 |
Max Process Temperature | 200 °C |
Process Temperature Control Accuracy | ±2 °C |
Compatible Wafer Size | 8 inch (200 mm); 12 inch (300 mm) optional |
Maximum Wafer Warpage | 3 mm |
Dwell Time Range (per zone) | 1 sec ~ 99 min 59 sec |
Heat-up Time (Ambient to 200 °C) | 10 minutes |
Process Gas | GN₂ |
Exhaust Type | General hot exhaust line |
Alarm Items | Over-temperature / Under-temperature, Gas abnormality, Coolant fault, Motor overload torque |
Wafer Support Pins | 3 pins |
Power Input | 200 ~ 240 VAC, 50/60 Hz, 1/3 Phase |
Peak Power @ 240 VAC | 35 kW |
Normal Operating Power Consumption | ≤ 50% of peak power |
Equipment Weight | 900 kg |
Overall Dimension (L×W×H) | 1050 × 1050 × 1710 mm |
Temperature Uniformity | Refer to relevant technical documentation |