苏州盛格纳电子有限公司

SIP/ FCBGA/FC/WLP and PLP Cleaning Equipment

The WLP720 is specially designed for automatic cleaning of residual flux on WLP and PLP packaged products.

This system adopts a mesh belt conveying structure and applies a high-flow multi-stage top & bottom spray cleaning process. During the cleaning phase, heated chemical solution decomposes residual flux chemically, while high-pressure spraying delivers mechanical scouring. The flux inside packaged components is softened, decomposed and stripped for thorough removal. Afterwards, multi-stage DI water rinsing flushes away residual cleaning solution on wafers and substrates and reduces ionic contamination to ensure high cleanliness. Finally, air knife and hot air drying sections eliminate remaining moisture, and the dry products are conveyed to the next process.

During operation, products are loaded onto the mesh belt at the inlet and transported at a preset speed through cleaning, rinsing, air knife and drying zones in sequence, before being discharged from the outlet. The unit can be connected with load/unload stations and connecting conveyors to form a fully automatic cleaning line.

Infeed → Chemical Cleaning 1 → Chemical Cleaning 2 → Chemical Cleaning 3 → Chemical Isolation → DI Water Pre-Rinse → DI Water Rinse 1 → DI Water Rinse 2 → Final DI Water Rinse → Air Knife → Hot Air Drying 1 → Hot Air Drying 2 → Outfeed

SPECIFICATIONS