苏州盛格纳电子有限公司

REFLOW SOLDER/CURING OVEN

Sikama International's Falcon 1200 is  a  multi-purpose  oven capable of temperatures up to 750°F(400°C) that can be used as areflow solder or epoxy curing system. Using Sikama's unique thermal technology which combines conduction and forced therma convection, the Falcon1200 contains 1 load zone, 7 heat zones and 2 cooling zones as well as automatic load and unload buffers with sensors providing a SMEMA interface connection to link into automated production lines. The system may be operated with air, nitrogen, or forming gas.

Prior to entering the heat zones, the temperature of the substrate is stabilized by the liquid-cooled load  zone.  Each  heat  zone  has  individual  setpoint  and  gas  flow  controls  that  maintain  platen temperature  to  +/-2°C  to  ensure  consistent  and  precise  temperature  for  reliable,  repeatable profiles. The gas  is  introduced  into the  reflow  chamber through  perforations  in the  conduction heating platens and enters the chamber at the same temperature as each zone. The internal liquidcooled zone ensures a process cool down in an inert atmosphere. Further cooling of the substrates takes place as the product exits into the liquid cooled offload zone

Parts are transported through the furnace by sweeper bars that can operate continuously or in a"dwell" (timed delay) mode that is a unique feature offered only by Sikama and produces superior temperature  uniformity with  minimal floorspace.  The  Falcon  1200  can  also  be  equipped with  a“walking beam” transport system which picks up the product with internal rails and moves it to the next process zone.

With optional Windows  based software, the  Falcon 1200 can  be interfaced with a computer for storing  profiles,  monitoring  of  individual  heat  zone  temperatures,  data  logging,  speed  and  time controls, and remote operation. A tray to accommodate a laptop computer can be supplied.

The Falcon 1200 is well suited for reflow applications involving a broad range of substrate materials including wafer  bump  reflow,  insulated  metal-core substrates,  BGA,  high  mass  components,  die soldering, and epoxy curing applications such as underfill and glob-top. The Falcon 1200’s efficiency of operation and minimal use of electricity and gas are the result of Sikama's unique design for balanced heating and cooling that will result in optimal performance in a low cost solution.