苏州盛格纳电子有限公司

SOLDER REFLOW &CURING OVEN

Sikama International's Falcon 8500 is a multipurpose oven capable of temperatures up to400°C that can be used for reflow soldering and epoxy curing applications.  Sikama's unique thermal technology uses conduction heating  in  combination  with forced thermal convection to maintain precise temperature profiles.  The Falcon  8500  contains 1 load zone, 5 heat zones,  and 2 cooling zones. Automatic load and unload   buffers with appropriate sensors provide SMEMA interface connection to link into automated production lines. The system may be operated with air, nitrogen, or forming gas.

Prior to entering the heat zones, the substrate temperature is stabilized in the liquid-cooled load zone. Each heat zone has individual setpoint gas flow controls that maintain platen temperature  to within ±2°C to ensure consistent and precise temperatures for reliable, repeatable profiles. The gas is introduced into the reflow chamber through tiny perforations in the conduction heating platens and enters the chamber at the same temperature set for each zone. The internal liquid-cooled zone ensures  a  process  cool-down  in  an  inert  atmosphere.  Further  cooling  of  the  substrates  is accomplished as the product exits onto the liquid-cooled offload zone.

Parts are transported through the furnace by sweeper bars that can operate continuously or in a"dwell" (timed delay) mode. This feature is unique to Sikama and produces superior temperature uniformity  in  the  reflow  profile.  The  Falcon  8500  can  also  be  equipped  with  a“walking  beam”transport system which picks up the product with internal rails and moves it to the next process zone.

With optional Windows-based software, the Falcon 8500 can be interfaced with a computer (not included) to store profiles, monitor individual heat zone temperatures, continuously log data, adjust speed and time controls, and remotely operate the oven. A tray to accommodate a laptop computer is available.

The Falcon 8500 is well suited for reflow applications involving a broad range of substrate materials including wafer bump reflow, insulated metal-core substrates, BGA, high mass components and die soldering, as well as epoxy curing applications including underfill and glob-top. The Falcon 8500’s efficiency of operation and minimal use of electricity and gas are the result of Sikama's unique design for balanced heating and cooling that will ensure optimal performance at the lowest cost.