苏州盛格纳电子有限公司

REFLOW SOLDER &CURING OVEN

The  UP1200 is a multi-purpose,  continuous flow,  Reflow Soldering Oven capable of temperatures up to 400°C. It is designed to process up to 300mm wafers and any application  requiring full  chamber  cover  gas with <5ppm O2 levels across all zones, virtually no vibration,  and  complete profile customization.  The UP1200 uses Sikama’s unique  conduction heating  in  combination with thermal convection and  radiant  heating to provide unmatched thermal energy transfer and the lowest energy use of any comparable reflow oven.

With eight work zones internal to the oven—six heat zones and two cooling zones—users can achieve complete control over profiles in the smallest footprint in the industry. We provide full SECS/GEM and SMEMA capabilities to allow easy integration into automated production lines and SPC data capture.

No other oven provides these levels of carbon-conscious performance with a space-saving footprint.

Two Transport Systems to Choose From

The UP1200 is built with either a walking beam transport (Model: UP1200) or the LIFT rail system(Model: UP1200 LIFT). The LIFT rail system can accommodate warped wafers and heavier work items than the walking beam transport system. Both systems lift the work item above the bottom contact heating zones and carry it to the next zone. The work item is not dragged or pushed, reducing the possibility of damage due to scraping, scratching, or vibration.