苏州盛格纳电子有限公司

REFLOW SOLDER AND CURING OVEN

Sikama International's  versatile Ultra Profile 2000 Solder Reflow oven combines bottom-up conduction with top-down convection heat, precise  temperature calibration and  purity of atmosphere.  

The oven can  be used as a standalone unit or as part of an automated  assembly line using the SMEMA communication standard. It offers  multiple   load  and  unload  configurations ensuring that it can fit even the most constrained production floors.

The Ultra Profile 2000 is a seven-zone system with 4 heat zones and 3 cool zones. It features a liquid-cooled load and unload platform, top and bottom conduction plus convection heat zones, and cool zones utilizing liquid cooling.  Each top and bottom heat zone has independent set point and gas flow controls to ensure consistent temperatures for greater profile flexibility.

The internal cooling zone ensures a process cool-down in an inert atmosphere prior to the product exiting to the offload platform.    Parts are transported through the system using sweeper bars or walking beams that operate in a "dwell" (timed delay) mode allowing adjustable cycle times. The walking   beam   transport   system   minimizes   any  wear   on   both   components   and   machine. The system may be operated with air, nitrogen or forming gas.  The gas flow enters the chamber through  small  orifices  in  the  top  and  bottom  heated  platens  and  exits  the  sides  to  prevent contamination of adjoining zones and minimize flux buildup.   In addition to heating inert gas, the top   platens   contribute   radiant   heat   to  the   reflow   process   and   are   easily   adjustable  to accommodate a broad range of component heights while maintaining accurate temperatures and atmosphere.

Capable of  heating  up to 752°F (400°C), the  UP2000  is targeted  at  applications  involving die soldering, BGAs, flip chips, and insulated metal core substrates. The oven may also be used for processing high-density components and substrate materials ranging from copper to ceramic to beryllium, and glass epoxy. The oven is ideally suited for lead frames and Auer Boats.

The UP2000 efficiency of operation and minimal use of electricity and gas, along with the small footprint are the results of Sikama’s unique design for balanced heating and cooling.